POP Implementation - メーカー・企業と業務用製品 | イプロスものづくり

POP implementation

We would like to propose a new Pop implementation.

POP implementation (Package on Package) is a technology used in mobile phones and other devices that require high-density packaging, allowing components to be stacked in a three-dimensional manner in two or three layers. While the typical POP implementation involves a CPU on the bottom layer and memory on the top layer, we also propose conversion boards for purposes such as extracting signal patterns from BGA for evaluation or modifying circuits due to pattern errors. We can also accommodate pre-stacking, where components are layered before assembly.